
Sapphire Protective Windows for UV Laser Debonding in HBM and Hybrid Bonding: 355 nm Transmission, Laser Damage Threshold, AR Coating and Debris Control
High-bandwidth memory, 3D DRAM and hybrid-bonded semiconductor packages require increasingly thin device wafers and dies. Temporary bonding provides mechanical support while these fragile wafers undergo back grinding, TSV processing, metallization, cleaning, inspection and other manufacturing steps. After processing, the device wafer or functional layer must be separated from its temporary carrier without introducing cracks, excessive








